Shuttle releases XPC Slim DH670 ultra-compact form-factor machine

by ddos · May 9, 2022

Shuttle announced the launch of a new generation of ultra-compact form-factor (UCFF) machines XPC Slim DH670, with an overall size of 190 x 165 x 43 mm and a volume of only 1.3L. Shuttle has been engaged in UCFF production since the Socket370 era. It is the world’s first minicomputer manufacturer and has very rich experience in the field of mini hosts and embedded systems.

The XPC Slim DH670 is based on Intel’s H670 chipset, supports the 12th-generation Core series (Alder Lake-S) processors in the LGA 1700 socket, supports up to 65W TDP, and has up to 16 cores and 24 threads. It can be equipped with up to 64GB of DDR4-3200 memory; has a 2280/2260/2242 size M.2 Key-M slot for storage, and an M.2 Key-E slot for Wi-Fi and Bluetooth modules. In terms of video output, four display outputs are provided, of which two DisplayPort interfaces and two HDMI 2.0b interfaces support 4K@60Hz output.

Shuttle also configures a variety of interfaces for XPC Slim DH670, including two GbE ports (Intel i210/i211), four USB 3.2 Gen 1 ports (one of which is a Type-C port), four USB 3.2 Gen 2 ports, two COM headers, an SD card reader and audio input /output. In addition, it is also equipped with a SATA 6.0Gbps interface, retaining a 2.5-inch hard drive position.

The XPC Slim DH670 is powered via a 19V DC jack, and Shuttle has equipped this UCFF system with a 120W power supply. It can be used in a variety of application scenarios, but it is not suitable for applications that require a high-performance GPU, such as performance-critical gaming or development work. Since there is no Thunderbolt 3/4 interface, it cannot be used with an external GPU, and you can’t expect too much in terms of graphics operations.

Shuttle has not disclosed the price of XPC Slim DH670 for the time being, and the specific listing time is unknown.

Shuttle releases XPC Slim DH670 ultra-compact form-factor machine

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