Samsung launches a new generation of 2.5D packaging solution H-Cube
Samsung announced that it has developed a new hybrid substrate packaging technology H-Cube (Hybrid Substrate Cube). This is Samsung’s latest 2.5D packaging solution, which is a high-performance and large-area packaging technology, specifically used in high-performance computing (HPC), artificial intelligence (AI), data center and network products, and other fields.
In today’s period when the supply of large substrates is difficult and the requirements for system integration are increasing, Samsung and Amkor Technology have successfully developed the project together, which is not easy. Samsung said that by expanding and enriching the foundry ecosystem, it will provide a wealth of packaging solutions to help customers break through challenges.
2.5D packaging enables logic chips or high-bandwidth memory (HBM) to be placed on a small-size silicon interposer, while H-Cube can integrate two substrates with different characteristics, ABF and HDI, to achieve a larger 2.5D package. With the development of market segments such as HPC, AI, and network applications, the number and size of chips installed in the same package are increasing, and high bandwidth is required for interconnection. This larger-area packaging has become more important, and the emergence of H-Cube has also lowered the barriers to entry for markets such as HPC.
When six or more high-bandwidth memories are integrated, the difficulty of manufacturing large-area ABF substrates will increase rapidly and will lead to a decline in production efficiency, and H-Cube can solve this problem by superimposing a large area HDI substrate structure on the ABF substrate. H-Cube shortens the distance between the solder balls of the chip and the substrate by 35%, reduces the basic size of the ABF, and the added HDI substrate ensures the connection with the system board.
Samsung also uses proprietary signal/power integrity analysis to allow the integration of more logic chips and high-bandwidth memory, H-Cube can also maintain a stable power supply and signal transmission, thereby reducing loss or distortion and increasing the reliability of the solution.
