Samsung is preparing to launch 512GB DDR5 memory
At the Hot Chips 33 conference, Samsung announced that they are developing DDR5 memory with an 8-layer TSV package, and now Samsung’s DDR4 is packaged with a 4-layer TSV, which makes the capacity of DDR5 memory twice that of DDR4. In the future, a single 512GB DDR5 will become possible.
According to a report from Computerbase, Samsung has reduced the gap between chips by 40% by optimizing packaging and using thin wafer technology. This makes the DDR5 height of the 8-layer TSV package actually lower than the 4-layer DDR4, and it also brings better heat dissipation.
The capacity of DDR5 memory can reach 512GB, which is a huge improvement compared with DDR4. At present, DDR4 memory for the server market can be up to 256GB per root, while the consumer market is up to 64GB and 32GB.