Samsung has reached an agreement with AMD to provide HBM3 and packaging technology for Instinct MI300 series

Earlier reports intimated that due to a significant surge in demand for the A100 and H100 data center GPUs and given TSMC’s (Taiwan Semiconductor Manufacturing Company) constrained production capacities, NVIDIA entered negotiations with Samsung, possibly to delegate some manufacturing responsibilities. Samsung’s aspirations aren’t limited to mere packaging orders; they are keen to secure a portion of the HBM3 orders, traditionally managed by SK Hynix. With AMD’s forthcoming Instinct MI300 series set for dispatch, requiring both HBM3 and 2.5D packaging, this alludes to an even tighter production strain.

According to Hangyunk, AMD has inked an agreement with Samsung, wherein the latter shall undertake the provision of HBM3 and packaging technology for the Instinct MI300 series. Considering that TSMC’s packaging capacity is consumed by NVIDIA’s bulk orders, this situates AMD’s new product line in a rather precarious position. If AMD seeks to further penetrate the artificial intelligence market, it direly requires additional collaborators to share the workload, offering Samsung a timely entreé.

Samsung has recently surpassed the pivotal quality tests for HBM3, laying the groundwork for its collaboration with AMD. Capturing the order for AMD’s Instinct MI300 series, some industry analysts forecast Samsung will command 50% of the HBM market share next year. Samsung has also proposed a new scheme to NVIDIA, where a dual-source strategy might be more beneficial, optimizing production capabilities. However, NVIDIA must be circumspect about its relations with TSMC.

Based on the available data, the Instinct MI300 product lineup might encompass:

  • Instinct MI300A (CPU+GPU): 6 XCDs (up to 228 CUs/CDNA 3 architecture), 3 CCDs (up to 24 cores/Zen 4 architecture), 8 HBM3 stacks (totaling 128GB)
  • Instinct MI300X (GPU exclusive): 8 XCDs (up to 304 CUs/CDNA 3 architecture), 0 CCDs, 8 HBM3 stacks (totaling 192GB)
  • Instinct MI300C (CPU exclusive): 0 XCDs, 12 CCDs (up to 96 cores/Zen 4 architecture), 8 HBM3 stacks (totaling 128GB)
  • Instinct MI300P (GPU exclusive): 4 XCDs (up to 152 CUs/CDNA 3 architecture), 0 CCDs, 8 HBM3 stacks (totaling 64GB)

Furthermore, akin to NVIDIA and Intel, AMD might maneuver around pertinent export restrictions through tailored products, exploring opportunities to cater to Chinese clientele with AI solutions, specifically tailored for the Chinese market.