Samsung Exynos 2400 may benefit from FoWLP packaging
In October this year, Samsung launched its latest generation mobile processor, the Exynos 2400. Building upon the foundation of the Exynos 2200, Samsung implemented several enhancements. Notably, the CPU performance has been boosted by an impressive 70%, while the acceleration of Artificial Intelligence (AI) workloads has skyrocketed by a staggering 14.7 times. Additionally, the GPU now incorporates the RDNA 3 architecture, offering improved gaming and ray-tracing capabilities.
However, at the time of release, Samsung did not disclose specific details, such as the fabrication process and packaging used for the SoC. Recently, some netizens have revealed that the Exynos 2400 boasts numerous design advantages. These include a GPU co-designed with AMD, boasting graphic performance surpassing Apple’s A17 Pro; the use of a 4nm LPP+ manufacturing process, where Samsung’s accumulated process expertise contributes to higher yield rates and performance; and the first application of Fan-Out Wafer-Level Packaging (FoWLP), which occupies less packaging area compared to traditional packaging, allows for more contact points without increasing the chip size, and results in a thinner chip with improved heat dissipation.
According to previously leaked benchmark scores, the Exynos 2400’s Xclipse 940 GPU does indeed show substantial performance improvements, exceeding the second-generation Snapdragon 8 and slightly below the third-generation Snapdragon 8. Of course, what is of greater concern is the power consumption and heat dissipation performance, which were among the primary criticisms of the previous Exynos 2200.
The CPU configuration of the Exynos 2400 follows a 1+2+3+4 quad-cluster architecture, comprising 1 super-core (Cortex-X4@3.10GHz), 2 high-frequency large cores (Cortex-A720@2.90GHz), 3 low-frequency large cores (Cortex-A720@2.60GHz), and 4 small cores (Cortex-A520@1.80GHz), totaling 10 cores. According to Samsung, the performance has improved by 70% compared to the Exynos 2200, raising questions about whether it can keep pace with Qualcomm’s advancements.
