Qualcomm may integrate X60 5G baseband for Snapdragon 875
In 2019, Qualcomm launched the Snapdragon 855 Plus chip, which is a product with a slightly enhanced performance compared to the Snapdragon 855 chip. Both use the Kryo 485 architecture and 7nm process. Besides, there is no update in terms of functions.
This year, when Qualcomm released the Snapdragon 865 Plus chip, in addition to some small improvements in performance, it also unexpectedly added support for WiFi 6E and Bluetooth 5.2. This makes it a common practice every year to update the Plus version of the chip. People are interested in looking forward to it.
Today, whistleblower Roland Quandt tweeted on Twitter that there will still be the Snapdragon 875 Plus chip next year, its codename is Lahaina+.
Qualcomm has Lahaina (what I think is SM8350 aka SD875) coming. We knew that. There's also Lahaina+.
— Roland Quandt (@rquandt) September 24, 2020
According to recent news in the technology circle, this Snapdragon 875 Plus chip may also be named the Snapdragon 875G chip, and it will be foundry by Samsung, which has just received a Qualcomm USD 850 million production agreement.
At the same time, there is also news that the Snapdragon 875 chip will use the new Kryo 685 architecture, based on the ARM Cortex X1 Super Core, and its performance is 20% better than Cortex A77.
The news also stated that Qualcomm may integrate an embedded Snapdragon X60 5G modem for the Snapdragon 875 chip and will no longer require customers to purchase a separate 5G baseband.
Via: wccftech
