AMD has officially
launched the world’s first data center CPU with 3D chip stacking, the EPYC 7003X series with 3D V-Cache technology, codenamed Milan-X. The new technology can bring an additional 64MB of 7nm SRAM cache to each CCD so that the L3 cache capacity of the processor is increased from 32MB to 96MB, and the capacity is tripled, increasing the maximum L3 cache capacity of EPYC 7003X series CPU to 768MB. AMD previously stated that compared to the original EPYC 7003 series, the EPYC 7003X series can bring a 66% performance improvement for various computing workloads.
Microsoft is also updating the Microsoft Azure HBv3 VMs to AMD Milan-X processors, while the service price remains the same. Since the interface of the EPYC 7003X series has not changed, it is compatible with existing platforms and can achieve a smooth transition. According to Phoronix, in tests conducted by Michael Larabel after Microsoft updated the EPYC 7003X series, it was proved that the new processor brought a significant performance improvement.
Michael Larabel used benchmark results prior to November 2021 as the benchmark for the new HBv3 VM test. The first benchmark was done using Azure standard_HB120-64r3_v3 (64 cores) instances and standard_HB120rs_v3 (120 cores) instances to see the difference between the two cores.
Michael Larabel has performed extensive benchmarking workloads via MPI across multiple VMs, analyzing HBv3 and enhanced HBv3 using CentOS 8 and various workloads. The results show that the increased cache gives the Milan-X processor a clear advantage over previous Milan processors in mixed workloads. Overall, Microsoft’s replacement is beneficial and works well.