The Dimensity 8200 is manufactured using TSMC’s 4nm process, and the CPU part is a 4+4 architecture, including four large cores (Cortex-A78@3.1 GHz) and four small cores (Cortex-A55); the GPU is Mali-G610, which supports mobile ray tracing Vulkan SDK; the AI processor APU 580 is integrated to provide powerful AI computing power while reducing AI application power consumption.
Dimensity 8200 is equipped with MediaTek HyperEngine 6.0 game engine, which supports intelligent frame stabilization 2.0, AI-VRS variable rate rendering, CPU multi-threaded intelligent optimization, 5G fast channel, and other technologies, allowing high-frame games to run at the full frame for a longer period of time, reducing game stutter and delay; support adaptive refresh rate technology, which can intelligently adjust the refresh rate of the screen display according to the display content, bringing a smoother display effect; Imagiq 785 image signal processor, supports 320-megapixel main camera, supports three cameras to shoot 14-bit HDR video at the same time, and supports AI noise reduction (AI-NR) function, which can accurately and quickly capture image details in low-light environments; support Bluetooth audio LE Audio; support Wi-Fi 6E; integrate 5G modem, support 5G Sub-6GHz full-band network and three-carrier aggregation.
According to MediaTek, Dimensity 8200 helps terminals fully unleash the advantages of high performance and high energy efficiency. It is understood that smartphones equipped with Dimensity 8200 5G mobile chips will be launched in the fourth quarter of 2022.