MediaTek releases Dimensity 8050 SoC: Update based on Dimensity 1300/1200
MediaTek announces the launch of the Dimensity 8050, an update to its 5G SoC product line. The new chip represents a modest update from the previous Dimensity 1300/1200, with virtually no changes in specifications.
The Dimensity 8050, fabricated using TSMC’s 6nm process, features a tri-cluster CPU architecture consisting of a prime core (Cortex-A78@3.0 GHz), three large cores (Cortex-A78@2.6 GHz), and four small cores (Cortex-A55@2.0 GHz). The GPU is a 9-core Arm Mali-G77 MC9, supporting 4266 Mbps quad-channel LPDDR4x memory and dual-channel UFS 3.1 flash storage. MediaTek MiraVision image enhancement technology supports HDR10+ video playback and AV1 hardware decoding, with AI HDR video enhancement and HDR10+ video quality improvement. It also supports FHD+ resolution and a 168Hz refresh rate display.
The Dimensity 8050 supports a 200MP primary camera, while multi-camera configurations include 32MP+16MP options. Night scene photography processing speed is 20% faster than the previous generation, and it supports single-frame, line-by-line 4K HDR video technology (Staggered HDR), allowing for triple-exposure fusion processing for each frame, increasing the dynamic range of video images by 40%. With the integrated AI processor APU 570, AI Super Panorama seamlessly merges AI noise reduction, AI exposure, and AI object tracking technologies, while maintaining precise image stitching effects. Equipped with MediaTek’s HyperEngine gaming engine, it supports advanced technologies such as AI-VRS variable rendering and intelligent control.
The new platform supports Wi-Fi 6 and Bluetooth 5.2, integrates a 5G modem, and includes a Sub-6GHz 5G modem with downlink speeds of up to 4.7 Gbps and uplink speeds of up to 2.5 Gbps. It supports 5G dual carrier aggregation, 5G dual SIM dual standby, and dual SIM VoNR. MediaTek‘s 5G UltraSave 2.0 power-saving technology enables lower power consumption and longer battery life for 5G communication.
