MediaTek releases Dimensity 6100+ for mainstream 5G terminals
MediaTek has announced the introduction of the Dimensity 6100+, augmenting mainstream 5G devices. The corporation attests that the new SoC exhibits exceptional power efficiency and supports advanced features like high-definition display, high refresh rates, and AI-assisted photography. It also provides reliable and stable Sub-6GHz 5G connectivity, propelling the proliferation of low-power, long-lasting 5G mobile experiences.
“As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs.”
Fabricated using the 6nm process, the Dimensity 6100+ employs a 2+6 architecture CPU, including two high-performance cores (Arm Cortex-A76) and six efficiency cores (Arm Cortex-A55). It supports advanced imaging technology and billion-color displays, as well as 90Hz-120Hz high refresh rates. The SoC integrates a 5G modem compliant with the 3GPP Release 16 standard and supports 140MHz bandwidth 5G dual carrier aggregation. It is also equipped with MediaTek’s 5G UltraSave 3.0+ technology, reducing 5G communication power consumption by 20%. Support for 108MP high-definition main camera and 2K@30fps video recording is provided. AI-assisted bokeh effect enhances terminal photography, yielding more captivating portraits and selfies. Collaboration with ArcSoft on AI-Color technology fosters user creativity to its fullest.
The Dimensity 6100+ further diversifies MediaTek’s product lineup, with related devices anticipated to be launched within the third quarter of 2023.
