MediaTek releases Dimensity 8000 series: use the highly advanced TSMC N5 production process
MediaTek announced the launch of a new generation SoCs, called the Dimensity 8000 series, including the Dimensity 8100 and the Dimensity 8000. MediaTek said the new SoC could bring more advanced network connectivity to high-end 5G smartphones, as well as gaming, multimedia, and imaging technologies.
Both the Dimensity 8100 and the Dimensity 8000 are manufactured using TSMC’s 5nm process, and the CPU part uses an eight-core architecture, including four large cores (Cortex-A78) and four small cores (Cortex-A55). Among them, the base clock of Dimensity 8100 is 2.85GHz, while that of Dimensity 8000 is 2.75GHz. The GPU of the Dimensity 8000 series is an Arm Mali-G610 with six cores, which integrates the MediaTek HyperEngine 5.0 game engine and supports four-channel LPDDR5 memory and UFS 3.1 flash memory. In addition, the Dimensity 8000 series also integrates the fifth-generation AI processor APU 580 and is equipped with the Imagiq 780 image signal processor.
The Dimensity 8000 series can support up to 200 million pixel cameras, as well as 4K60 HDR10+ and dual-camera HDR video recording, and introduces MediaTek’s latest AI noise reduction and AI anti-blur technology; 5G modem complies with 3GPP R16 standard, supports 5G Sub-6GHz full-band network and 2CC CA dual-carrier aggregation technology; support MediaTek 5G UltraSave 2.0 power-saving technology; support Wi-Fi 6E and Bluetooth 5.3, and Wi-Fi Bluetooth dual-connection anti-jamming technology.
In addition to releasing the Dimensity 8000 series this time, MediaTek also launched the Dimensity 1300 5G mobile platform. The Dimensity 1300 is also an eight-core architecture in the CPU part, including one super core (Cortex-A78@3.0 GHz), three large cores (Cortex-A78), and four small cores (Cortex-A55). GPU is Arm Mali-G77, and it is equipped with the third-generation APU of MediaTek. It can support up to 200 million pixel camera, integrated MediaTek HyperEngine 5.0 game engine.
