Intel will introduce the Foveros package at Hot Chips 34
This year’s Hot Chips 34 will be from August 21st to August 23rd, when Intel, AMD, Nvidia, Arm, MediaTek and Tesla, and other companies will have various speeches and presentations. The focus of this conference is on data center, graphics, processor technology, and accelerated computing. The organizer has announced the schedule, in which on August 23, Wilfred Gomes, Intel’s microprocessor technology and design, will give a speech on Meteor Lake and Arrow Lake, focusing on the 3D packaging technology called Foveros.
According to past news, Meteor Lake and Arrow Lake will be released in 2023 and 2024 respectively, using Tile design, through EMIB interconnect technology and Foveros packaging technology. Modules from different process nodes and fabs are stacked and packaged together. The processes involved include Intel4 and Intel 20A, as well as TSMC’s N3. It is widely believed that Meteor Lake and Arrow Lake will use the same platform, and the relationship between the two is similar to that of Alder Lake and Raptor Lake.
In an earnings call with analysts and investors some time ago, Intel CEO Pat Gelsinger said that Meteor Lake (14th generation Core) has successfully booted Windows, Chrome, and Linux systems, which is a new milestone, marking the Intel 4 process ( 7nm process) technology is progressing smoothly. Then Intel showed the Meteor Lake chips to the visiting media at Intel Vision, two packaging methods, namely “standard” and “high density”.
It is understood that Meteor Lake will be launched first on mobile platforms and is also the first Core series to use the Xe-HPG architecture. It is rumored that Arrow Lake-P’s GPU will be equipped with up to 320 EUs, more than three times that of Alder Lake-P.
