Intel showcases Meteor Lake chip packaging
In an earnings call with analysts and investors some time ago, Intel CEO Pat Gelsinger said that Meteor Lake (14th generation Core) has successfully boosted in Windows, Chrome, and Linux systems, which is a new milestone, marking the Intel 4 process ( 7nm process) technology is progressing smoothly.
At Intel Vision today, Intel showed off Meteor Lake chips to the visiting media. According to Twitter user @CarstenSpille, Meteor Lake chips are available in two packages, standard, and high density. In theory, each package can provide the same configuration, but the power characteristics will vary, and smaller packages are likely to appear in designs such as 2-in-1 ultra-thin notebooks.
Intel first demonstrated the Meteor Lake test chip as early as the third quarter of 2021. It adopts the Tile design, and there are at least three different modules, namely the computing module, the SOC-LP module (responsible for I/O), and the GPU module. Intel will use EMIB interconnect technology and Foveros packaging technology to stack and package modules from different process nodes and fabs. Intel will use its own Intel 4 process for the first time in Meteor Lake, adding EUV lithography technology to manufacture computing modules.
Meteor Lake uses the second-generation hybrid architecture technology. The performance core will enable the Redwood Cove architecture to replace the current Golden Cove architecture, and the energy efficiency core should continue to use the Gracemont architecture. The GPU module has a minimum configuration of 96 EUs and a maximum configuration of 192 EUs, which maybe Intel’s first module manufactured using TSMC, which is manufactured on a 3nm process.
