Intel is about to sign an agreement with the Italian government for chip factory
According to Reuters, Intel is about to sign an agreement with the Italian government to build a packaging and assembly plant at a cost of $5 billion. The project will be supported by government funds and is expected to account for 40% of the cost. At the same time, there will be other subsidies or concessions in the future. The content of the agreement is expected to be announced at the end of this month. Tower Semiconductor had already been in contact with the Italian government before Intel’s acquisition, and Intel’s own intentions in this regard have greatly promoted the project.
Several regions of Italy have shown strong interest in Intel’s projects, including Apulia, Lombardy, Piedmont, Sicily, and Veneto. The Piedmont and Veneto regions in the north, where Intel is expected to have a new packaging and assembly plant, are rumored to be the most promising candidates for the chip factory.