Cortex X5 architecture is underperforming compared to expectations

Recently, insights from the user Revegnus through channels have surfaced, revealing that the Arm Cortex-X5 core exhibits substantial power consumption when operating at high frequencies. Without adequate cooling, this can lead to thermal throttling, potentially resulting in performance that falls short of expectations.

There have been rumors that MediaTek will continue to employ a “big core” CPU architecture similar to the Dimensity 9300, utilizing TSMC’s second-generation 3nm process (N3E). The Dimensity 9400’s “big core” CPU architecture, potentially a tri-cluster configuration of 1+3+4, is expected to introduce a super-core based on Cortex-X5, comprising one Cortex-X5, three Cortex-X4, and four Cortex-A720 cores, aimed at further enhancing performance in hopes of surpassing Qualcomm’s fourth-generation Snapdragon 8. If Revegnus’s information holds, then integrating just a single Cortex-X5 super-core into the Dimensity 9400 appears to be a prudent decision.

On the other hand, Qualcomm plans to introduce custom Oryon cores incorporating NUVIA technology in this year’s flagship chips, moving away from the conventional Arm-based design and thus, likely unaffected by the architectural constraints of Arm. Rumors suggest that the fourth-generation Snapdragon 8 will abandon the use of efficiency cores in favor of a new dual-cluster octa-core CPU architecture, featuring 2 Nuvia Phoenix performance cores and 6 Nuvia Phoenix M cores, all manufactured using the N3E process with core frequencies reaching up to 4.0GHz.

However, Qualcomm executives have hinted at a higher price point for the new chips, suggesting that smartphone manufacturers may need to increase the retail prices of their devices to mitigate any significant impact on profit margins. The performance of the Dimensity 9400 will greatly influence the pricing of devices powered by the fourth-generation Snapdragon 8 upon their release.