Today, Kioxia announced the debut of its latest generation UFS 4.0 flash memory chips, offering new products in 256GB, 512GB, and 1TB capacity specifications, designed for use in next-generation mobile applications, including high-end smartphones....
At the GTC 2024 conference held at the San Jose Convention Center in California, Jensen Huang, the founder, and CEO of Nvidia, introduced products based on the Blackwell architecture for data centers, which in...
At the beginning of this month, JEDEC established specific standards for GDDR7 memory. At the ongoing GTC 2024, NVIDIA presented only its data center products, omitting any showcase of the Blackwell architecture designed for...
Recently, SK Hynix announced the commencement of mass production of its latest memory product, HBM3E, and plans to supply it to key clients by the end of March. These clients include NVIDIA, which possesses...
High Bandwidth Memory (HBM) products are regarded as one of the cornerstones of artificial intelligence (AI) computing, with the industry witnessing rapid development over the past two years. Under the influence of artificial intelligence...
High Bandwidth Memory (HBM) products are regarded as one of the pillars of artificial intelligence (AI) computing, with the industry experiencing rapid development over the past two years. Influenced by the advancements in artificial...
Recently, JEDEC announced that Dell’s CAMM has officially become a JEDEC standard, christened as “CAMM2.” This heralds an era where an increasing number of laptops will adopt this new memory module design, likely replacing...
SK Hynix has announced its participation in the world’s largest electronics and IT exhibition, the International Consumer Electronics Show (CES 2024), scheduled for January 9-12, 2024, in Las Vegas, USA. At this event, they...
Despite a sluggish memory market this year, with many manufacturers suffering substantial losses, SK Hynix has astutely capitalized on the server market’s shift to DDR5 memory and the burgeoning opportunities in artificial intelligence (AI)....
At the dawn of this year, major motherboard manufacturers announced their support for single-slot DDR5 memory modules with capacities of 24GB and 48GB, compatible with Intel’s 700 and 600 series motherboards. Shortly thereafter, they...
Last year, Phison Electronics released its flagship PCIe 5.0 controller chip, the PS5026-E26, primarily targeting enterprise-level and high-end desktop gaming SSDs. Nowadays, the market has seen an emergence of numerous PCIe 5.0 SSDs, most...
In October, AMD officially launched the Ryzen Threadripper 7000 series processors, which boast significant enhancements in core architecture, CCD count, core number, and memory support compared to the Ryzen Threadripper PRO 5000. As the...
In recent years, the landscape of the semiconductor memory market has undergone a notable transformation. South Korea’s memory giants, Samsung and SK Hynix, are now facing intense competition from Chinese manufacturers, feeling the increasing...
SK Hynix is currently the market leader in HBM (High Bandwidth Memory) products, holding the largest market share and serving as a principal memory supplier for NVIDIA’s data center GPUs. Presently, SK Hynix, Samsung,...
Team Group has unveiled the T-FORCE VULCAN ECO DDR5 memory, a product that stands apart from conventional memory offerings. This new iteration embraces environmental consciousness, featuring heat spreaders crafted from recycled aluminum, rightfully earning...
Thermaltake has announced the launch of its new TOUGHRAM XG RGB D5 series memory, designed to support Intel’s 14th-generation Core processors. The TOUGHRAM XG RGB D5 series memory is available only in a 32GB...
