AMD will produce Zen 3 with 3D cache next month
AMD confirmed at a meeting some time ago that Zen 3 processors with 3D cache and Zen 4 architecture processors will not appear until next year. However, the production of the Zen 3 processor with a 3D cache will start within this year, and the Zen 3 processor with B2 stepping will also enter the market at the end of this year.
This information is released by Twitter user @Greymon55, the production of the Zen 3 processor with a 3D cache will start in November and is expected to be released at CES next year. It is expected to be available soon after the release, and Zen 4 will be on the market at the end of next year, so it will have 9 to 10 months to be the main product in the market.
The B2 stepping Zen 3 will be available in December, and there will be no changes in the architecture. However, compared with the current products on the market, the new stepping usually brings better stability and higher frequency. So you can expect that B2 stepping products will show better-overclocking capabilities.
AMD will use 3D cache Zen 3 and B2 stepping products to compete with the 12th generation Core Duo, and the existing Ryzen 5000 series products will also begin to reduce prices to make way for new products. The 3D cache will increase the L3 cache capacity of each CCD of Zen 3 from 32MB to 96MB, which is three times the original capacity. On the 12-core or 16-core Ryzen 9 processor with dual CCDs, there will be a total of 192MB of L3. A larger L3 cache will increase the processor’s game performance by 15%. AMD did not specify other aspects of performance. In theory, increasing L3 can increase the hit rate, but this will not greatly improve the computing performance of the core.
