TSMC’s U.S. factory will introduce a 3nm process

TSMC decided to build a new fab in Arizona, USA in 2020, which is currently under construction and is expected to be put into operation in 2024. The initial production capacity target is about 20,000 wafers per month (WSPM), and the process node is 5nm, which includes N5, N5P, N4, N4P, and N4X processes.

TSMC FINFLEX technology
According to TomsHardware, recently, TSMC founder Morris Chang also participated in the Asia-Pacific Economic Cooperation (APEC) summit held in Thailand. He confirmed that TSMC’s US factory has more advanced process plans, but the final plan has not yet been completely finalized. A senior person in the semiconductor industry revealed that the first stage of TSMC’s US factory is a 5nm process node, and the second stage is a 3nm process node. Since TSMC has many important customers in the United States, it is believed that there will be no shortage of orders after it is put into operation.

During the APEC summit, Mr. Chang met with many political and business leaders, including discussing the possibility of expansion in other regions. It is rumored that Mr. Chang met with several important leaders last weekend, and these places have TSMC’s fab projects.

It is understood that TSMC’s wafer fab project in Arizona, USA is currently progressing smoothly, and is ready to receive the production equipment required for the first phase. The installation ceremony for the first piece of equipment will be held on December 6. However, quite a few people in the industry are still worried that due to cultural differences, internal employees in the fab may have disagreements and friction in their actual work.