TSMC launches OIP 3DFabric Alliance
Recently, TSMC announced at the OIP Forum that it will launch the OIP 3DFabric Alliance, which will be the first innovation alliance in the semiconductor industry to accelerate the 3D IC ecosystem with partners to provide a full range of best-in-class solutions and services for semiconductor design, memory modules, substrate technology, test, manufacturing, and packaging. At present, 19 partners have joined, including Teradyne, SK Hynix, Arm, Siemens, Synopsys, etc.
TSMC hopes to help customers overcome the complexities of semiconductor design by creating new collaborative models that organize the development and optimization of technologies across TSMC, electronic design automation (EDA), and IP and design methodologies. Members of the OIP 3DFabric Alliance can obtain TSMC’s 3DFabric technology as soon as possible, and develop and optimize solutions simultaneously with TSMC, covering EDA, IP, DCA/VCA, memory, OSAT, substrates, and testing solutions and services.