TSMC launches OIP 3DFabric Alliance

by ddos ·

Recently, TSMC announced at the OIP Forum that it will launch the OIP 3DFabric Alliance, which will be the first innovation alliance in the semiconductor industry to accelerate the 3D IC ecosystem with partners to provide a full range of best-in-class solutions and services for semiconductor design, memory modules, substrate technology, test, manufacturing, and packaging. At present, 19 partners have joined, including Teradyne, SK Hynix, Arm, Siemens, Synopsys, etc.

TSMC OIP consists of six alliances, namely the EDA Alliance, IP Alliance, Design Center Alliance (DCA), Value Chain Alliance (VCA), Cloud Alliance, and now, the 3DFabric Alliance. The new alliance will help customers rapidly implement chip- and system-level innovations using TSMC’s 3DFabric technology, comprehensive 3D stacking, and advanced packaging technologies to drive next-generation HPC and mobile applications.


TSMC hopes to help customers overcome the complexities of semiconductor design by creating new collaborative models that organize the development and optimization of technologies across TSMC, electronic design automation (EDA), and IP and design methodologies. Members of the OIP 3DFabric Alliance can obtain TSMC’s 3DFabric technology as soon as possible, and develop and optimize solutions simultaneously with TSMC, covering EDA, IP, DCA/VCA, memory, OSAT, substrates, and testing solutions and services.

TSMC’s 3DFabric technology is an advanced packaging technology, including front-end 3D chip stacking or TSMC-SoIC (system-on-chip), back-end CoWoS and InFO series packaging technologies to achieve better performance, power consumption, size appearance, and function, to achieve system-level integration.

Tags: OIP 3DFabric AllianceTSMC