TSMC announced the launch of its “TSMC University FinFET Program”
TSMC announced that it has launched a TSMC University FinFET Program aimed at cultivating future semiconductor chip design talents and promoting global academic innovation. TSMC will work with service partners in Asia, Europe, and North America to support educational and test chip research projects.
According to the content of the project, TSMC will open the process design kit (PDK) for teachers, students and academic researchers of universities and colleges to use FinFET (fin field effect transistor) technology at 16nm, bringing the IC design learning experience to the advanced FinFET level. At the same time, the project will also provide Multi-Project Wafer (MPW) services for chip researchers in universities and colleges using N16 and N7 processes, so as to accelerate the introduction of influential innovative research into practical applications.
TSMC will provide the following resources to universities and colleges:
- Design collateral for teaching is based on TSMC’s N16 process and includes tutorial design cases, training materials, and instructional videos, bringing students from the conventional planar transistor structure into the FinFET era.
- For impactful research projects, TSMC is providing both N16 and N7 process design collateral for test chips to be manufactured via MPW. These include research designs in logic, analog, and radio frequency (RF).
TSMC’s Open Innovation Platform is the industry’s most complete and dynamic design ecosystem to support TSMC’s technology and manufacturing. TSMC partners participating in the Open Innovation Platform will also provide support for university FinFET projects, and interested academic institutions can also contact local partners through the website provided by TSMC.
