Team Group launches DDR5-6800 ECC R-DIMM memory
Team Group has announced the release of the DDR5-6800 ECC R-DIMM memory module. Team Group said it has collaborated with motherboard manufacturer ASRock to complete compatibility testing with the new Intel Xeon W-3400 series and Xeon W-2400 series processors, code-named Sapphire Rapids, and their accompanying W790 motherboards, fully supporting Intel XMP 3.0 technology.
In addition to increasing the JEDEC standard frequency to 5600MHz, Team Group also offers two high-frequency specifications, 6400MHz, and 6800MHz, with the latter being the highest factory overclocking frequency of the DDR5 ECC R-DIMM memory module currently available. Users can also overclock the frequency of the DDR5 ECC R-DIMM memory module in the BIOS to create the ultimate HEDT platform.
Team Group stated that the new DDR5 ECC R-DIMM memory module will be available in single 16GB and 32GB capacities, using SK Hynix’s A-Die chips. This DDR5 ECC R-DIMM memory module features a 30µ gold finger design, supports dual ECC error correction, and is equipped with a high-precision temperature sensor to improve durability and reduce the risk of overheating during memory overclocking, meeting the diverse application needs of high-end HEDT and workstations.
Team Group has not disclosed the release date and specific price of the new DDR5 ECC R-DIMM memory module. Previously, both ADATA and G.Skill have released overclockable DDR5 ECC R-DIMM memory modules, with ADATA stating that its overclocked DDR5-5600 R-DIMM memory module is expected to be officially released in the second quarter of 2023.