Previously, Samsung expected that the 4nm process will be mass-produced in 2021, and the 3nm GAAFET process may be launched in 2023. Compared to TSMC’s N3 process, Samsung is probably 6 to 12 months...
Recently many investment institutions are optimistic about TSMC, including investment banks JPMorgan Chase, Citigroup, HSBC, etc. The analysis report generally believes that with the increase in chip order prices from 2022, the world’s strong...
The problem of chip shortage has plagued the semiconductor industry for more than a year, and the current foundries are basically fully loaded. Since the supply is in short supply, the price increase is...
TSMC’s revenue in 2020 is approximately $47.44 billion. At present, TSMC’s momentum is very strong, and the development prospects of the semiconductor industry are also promising. I believe that there will be good development...
TrendForce released the latest foundry survey report. The data shows that the global foundry production value reached $24.407 billion in the second quarter of 2021, a month-on-month increase of 6.2%. Since the third quarter...
Recently, it has been reported that TSMC is preparing to increase the price of chip orders from 2022. It is rumored that the production price of 7nm or more advanced wafers will increase by...
In the past year, in addition to various shortages in the semiconductor industry, price increases have also often appeared. For example, UMC has raised prices several times during this period, very frequently. It even...
The semiconductor industry is facing a shortage of chips and related components is no big news. Similar news has been circulating for several quarters. Many companies have invested to increase production capacity. For example,...
TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) is a 2.5D packaging technology that can package multiple small chips on a substrate. It was first released in 2012. This technology has many advantages, but the main advantages are saving...
With its strong performance at the 7nm process node, TSMC has won orders from many industry giants such as Apple and AMD, and even Intel plans to use TSMC’s advanced process to ease manufacturing...
TSMC’s N2 process-related supporting wafer fab construction project is in progress. The location of the first wafer fab is located in the Hsinchu Science Park in Taiwan. The project will be carried out in...
Last year, the European Union launched a package of plans, hoping to fully control the design and production of advanced chips in the future. 17 of the 27 EU countries jointly issued a European...
For today’s high-performance chips, heat dissipation is a thorny issue. In addition to the traditional use of air-cooled heat dissipation with additional radiators, water-cooled heat dissipation seems to be a more efficient choice. Industry...
About three months ago, Jiangxi Hantang System, a supplier of TSMC, learned of the timetable for its investment of $12 billion to build a new fab in Arizona, USA. It is understood that TSMC...
Earlier, there was news that the Qualcomm Snapdragon 895, codenamed SM8450, will be manufactured using Samsung’s 4nm process. Qualcomm chose Samsung to meet the demand for production capacity. This is also one of the...
Although TSMC has not officially launched the N3 manufacturing process, the related fabs for the N2 process are already under construction. According to TSMC’s plan, two plants will be built for the production of...
