Nvidia is expected to use TSMC’s 3D SoIC stacking and chiplet packaging technology
At CES 2023, AMD unveiled three Zen 4 architecture desktop processors featuring 3D Vertical Cache (3D V-Cache) technology—the Ryzen 9 7950X3D, Ryzen 9 7900X3D, and Ryzen 7 7800X3D—all of which are now available on...
