Tagged: CoWoS packaging

Nvidia AI chip supply

Nvidia faces AI chip supply shortage

Since last year, TSMC, responsible for the manufacturing and packaging of NVIDIA’s AI chips, has experienced a tightening of capacity in advanced packaging. Consequently, TSMC has been relentlessly expanding its 2.5D packaging capacity to...

TSMC CoWoS packaging

TSMC will double its CoWoS packaging capacity this year

In recent months, the rise of Artificial Intelligence (AI) tools, spearheaded by ChatGPT, has dramatically increased the demand for data center GPUs like Nvidia’s A100 and H100. This surge in demand has placed considerable...