Snapdragon 8 Gen 3 will feature an improved CPU architecture with the introduction of Titanium cores
Recently, news emerged that Qualcomm’s Snapdragon 8 Gen 3 would undergo some design changes, including the introduction of a new core and changes to the configuration of big and little cores. In addition, it was announced that the platform would be manufactured using TSMC’s 4nm process technology.
According to Twitter user @Za_Raczke, Qualcomm’s new flagship model for 2023 is the “SM8650,” with an internal code name of “Lanai” or “Pineapple.” The CPU portion will adopt a unique 2+3+2+1 quad-cluster architecture, which includes:
- 2x Arm codename Hayes (A5xx) “silver” cores
- 3x Arm codename Hunter (A7xx) “gold” cores
- 2x Arm codename Hunter (A7xx) “titanium” cores
- 1x Arm codename Hunter ELP (Xn) “gold+” core
This time, Qualcomm has configured fewer power-efficient cores and provided more performance cores, and also used Titanium cores for the first time. There are rumors that the frequency of these cores will be higher and that their cache design will be different from that of the Gold cores, but there is currently no specific information on this. As previously reported, the third-generation Snapdragon 8 platform will support Android 14 and Linux Kernel 6.1, but will completely abandon support for 32-bit applications, which means there will be no Cortex-A710-based kernel in the cluster.
In addition, Snapdragon 8 Gen 3 will be equipped with the Adreno 750 GPU, with a frequency of about 750MHz to 770MHz. There are reports that the frequency of the Adreno 750 can reach 1GHz, which may be a special version, such as a customized chip used in the Samsung Galaxy S24 series smartphones, but this cannot be confirmed at this time. It is understood that the main goal of the third-generation Snapdragon 8 platform is to improve multi-core performance, and although there have been no major adjustments to the manufacturing process, power consumption, and heat dissipation may be the biggest challenges.