Samsung’s multichip package based on LPDDR5 UFS has begun mass production

by ddos · June 15, 2021

Samsung announced that it has begun mass production of its latest smartphone memory solution, which is a multi-chip package (uMCP) based on LPDDR5 UFS. Samsung’s uMCP integrates the fastest LPDDR5 DRAM and the latest UFS 3.1 NAND flash memory to provide smartphone users with flagship-level performance.

“Samsung’s new LPDDR5 uMCP is built upon our rich legacy of memory advancements and packaging know-how, enabling consumers to enjoy uninterrupted streaming, gaming, and mixed reality experiences even in lower-tier devices,” said Young-soo Sohn, vice president of the Memory Product Planning Team at Samsung Electronics. “As 5G-compatible devices become more mainstream, we anticipate that our latest multichip package innovation will accelerate the market transition to 5G and beyond, and help to bring the metaverse into our everyday lives a lot faster.”

Image: Samsung

Thanks to the latest mobile DRAM and NAND flash memory interfaces, Samsung’s uMCP can provide faster speed and large storage capacity with extremely low power consumption, allowing consumers to immerse themselves in many 5G applications. In the past, similar experiences could only be provided on high-end models, including an advanced camera, graphics-intensive games, and AR. Compared with previous solutions based on LPDDR4x DRAM and UFS 2.2 NAND flash memory, DRAM performance has increased by 50%, from 17GB/s to 25GB/s, and NAND flash memory performance has doubled, from 1.5GB/s to 3GB/ s, making flagship performance possible.

Samsung’s uMCP also helps maximize the space utilization of mobile phones. Its DRAM and NAND flash memory are integrated into a compact package measuring only 11.5 mm x 13 mm, leaving more space for other functions. The DRAM capacity of the new solution ranges from 6GB to 12GB, and the storage capacity ranges from 128GB to 512GB. It can be customized to meet the different needs of 5G smartphones in the entire mid-to-high-end market.

Samsung has completed compatibility tests with several global smartphone manufacturers, and it is expected that devices equipped with uMCP will begin to enter the market this month.

Samsung’s multichip package based on LPDDR5 UFS has begun mass production

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