Qualcomm launches 3D Sonic Max solution with ultrasonic fingerprint recognition

Since Apple began to use fingerprint recognition technology, more and more manufacturers are also using this tech, but Apple has turned to face recognition technology for its devices. But more users may prefer fingerprint recognition technology than face recognition technology because in some cases it is more convenient to use fingerprint recognition than face recognition. Of course, since users have needs, so now there are many Android devices that support both face recognition and fingerprint recognition technology. It’s just that the traditional fingerprint recognition technology is out of date. In the era of full screen, most Android flagship devices now use the fingerprint recognition solution under the screen.

Qualcomm recently introduced a 3D Sonic Max ultrasonic fingerprint recognition solution at the technology summit to replace the previous 3D Sonic solution. The biggest feature of the new solution brought by Qualcomm this time is that the recognition range is very large, and even users can use two fingers to identify and unlock. According to Qualcomm, the MAX version is 17 times larger than the previous version. The lower half of the basic screen can be identified without focusing on a certain area. The product manager of Qualcomm stated that the current mainstream technology has an identification area of ​​about 4 * 9 mm, and MAX’s identification area can reach 20 * 30 mm to identify the entire fingerprint part. In terms of features, it can still be recognized under the condition that the screen has slight pollutants or the fingers are wet, which is very convenient for users who sweat easily.

Qualcomm plans that the new fingerprint recognition solution will also be commercially available next year. It is estimated that it will be launched for commercial use at the same time as Qualcomm’s new Snapdragon 865 flagship processor. The new 3D Sonic Max in-screen fingerprint recognition solution is also very small in terms of hardware, and the sensor thickness is only 0.15 mm, making it easier to integrate.