Phison Electronics talked about PCIe Gen5, PCIe Gen 6 standard master chips
In the future, the speed and storage density of SSD will be further improved. Higher NAND flash memory density can not only reduce the price of products but also make storage products less restrictive in size. In addition, the next major upgrade is likely to reduce the number of channels, such as changing PCIe Gen 5/6 x4 to PCIe Gen 7 x2. Phison Electronics said that TLC will continue to develop. Although QLC is not particularly good in terms of writing speed, its reading speed has its advantages, or there will be some special applications.
At present, Phison Electronics recommends manufacturers equip SSDs based on PCIe Gen4 with heat sinks. For PCIe Gen5 products, this is a must. On next-generation SSDs, users may see solutions equipped with active cooling devices, because higher power consumption leads to more heat output. The TDP of the PCIe Gen5 standard SSD is 14W. When the PCIe Gen6 standard SSD is reached, the TDP will be increased to 28W. This will be the main challenge that the SSD will face in the future.