Micron announces the industry’s first SSD with 176-layer 3D TLC NAND flash memory

by ddos ·

Micron announced the launch of two new SSDs using the industry’s first 176-layer 3D TLC NAND flash memory chips, the 2450 series, and the 3400 series, both of which support PCI-E 4.0 to target different types of PCs and markets. Micron said that these SSDs are in production and will soon appear in the retail market.

The 2450 series SSD is aimed at the mainstream PC market. It provides M.2 2280/2242/2230 in three different form factors and provides three capacities of 256GB, 512GB, and 1TB. The sequential read and write speeds of the 256GB version are 3600MB/s and 1600MB/s, and the 4K random read and write are 190000 and 400000 IOPS respectively.

The sequential read and write speeds of the 512GB and 1TB versions are 3600MB/s and 3000MB/s, respectively. The former 4K random read and write are 380,000 and 500,000 IOPS, and the latter 4K random read and write are 450,000 and 500,000 IOPS, respectively.

The 3400 series SSD is aimed at the market for high-performance applications. It adopts the M.2 2280 specification and provides three capacities of 512GB, 1TB, and 2TB. The sequential read and write speeds of the 512GB version are 6600MB/s and 3600MB/s, and the 4K random read and write are 360,000 and 700000 IOPS respectively. The sequential read and write speeds of the 1TB and 2TB versions are 6600MB/s and 5000MB/s, respectively. The former 4K random read and write are 630,000 and 700000 IOPS, and the latter 4K random read and write are 720,000 and 700000 IOPS, respectively.

Micron stated that the 2450 series and 3400 series SSDs use a self-developed main control chip that supports NVMe 1.4, but the configuration can be more flexible. If necessary, a third-party main control chip can be used.

In addition to launching the 2450 series and 3400 series of SSDs, Micron also used its 96-layer 3D NAND flash memory for its first UFS 3.1 automotive-grade storage device. Compared with Micron’s original UFS 2.1 storage device, its continuous write performance has increased by 50%, and it is planned to be put into production in the third quarter of this year.

Tags: 176-layer 3D TLC NANDMicron