AMD will bring Zen 4 architecture CPU with 3D V-Cache technology as soon as 2023

Currently, AMD Ryzen 7 5800X3D has been lifted ban and will be on the market soon to meet consumers. This is the first and so far only consumer-grade processor with 3D V-Cache technology, which brings an additional 64MB of 7nm SRAM cache to the CCD, making the L3 cache capacity of this Zen 3 architecture processor increase from 32MB to 96MB.

AMD Ryzen 7 5800X3D ship

The 3D V-Cache technology impresses, and the Ryzen 7 5800X3D also proves that a larger L3 cache can be useful in some cases. Recently, Twitter user @greymon55 revealed that there is currently only one packaging line responsible for 3D V-Cache technology, so the supply of this type of processor is relatively limited. Before Zen 3 architecture processors with 3D V-Cache technology are discontinued, there will be no Zen 4 architecture processors of the same type, which means that the earliest batch of Zen 4 architecture processors will not have 3D V-Cache technology, and won’t appear until 2023 at the earliest.

This year AMD will launch the Ryzen 7000 series based on the Zen 4 architecture, and the new generation of processors codenamed Raphael will use the new AM5 socket (LGA 1718), manufactured using TSMC’s 5nm process, it integrates RDNA 2 architecture core display, supports PCIe 5.0 and dual-channel DDR5-5200 memory. In addition to supporting USB 3.2, the new platform may also have native USB 4.0.

According to AMD’s introduction, its 3D chip stacking technology is based on TSMC’s SoIC technology. The two chips are milled into a perfect plane, there is a perfect alignment between the bottom CCX and the top L3 cache, and the TSV channels can be matched without any kind of adhesive material. To do this, AMD flipped the CCX, shaved off 95 percent of the top silicon, and mounted the 3D vertical cache chip on top. AMD finally implemented a shared ring bus design at the L3 level, making the entire L3 cache available to each core.