It is understood that, in fact, when Apple was developing the M1 processor, Samsung was already involved. Samsung Electro-Mechanics mainly provides the FC-BGA (full-chip ball grid array) package for Apple’s M1 processor. Due to the success of the M1 series, Samsung is expected to continue to participate in Apple’s research and development of the M2 processor but still provide the FC-BGA package project. However, the foundry of the M2 processor is likely to be completed by TSMC. Samsung officials have not made any announcements on providing FC-BGA packaging projects for M2 chips, so this is only a revelation from the industry media.
M2 series chips should be launched later this year. It is expected to be manufactured using TSMC’s 4nm process. Both performance and energy efficiency will be higher than the existing 5nm process, and there will be upgrades in CPU, GPU, and NPU, as well as video decoding performance.