Ryzen 7000X3D may have high bandwidth
AMD released a new generation of Ryzen 7000 series processors based on the Zen 4 architecture at the “together we advance_PCs” live event at the end of August this year. At the same time, it also shared a new CPU architecture roadmap, showing that there will be Zen 4 architecture chips with 3D vertical cache (3D V-Cache) technology next.
Recently, semiconductor packaging engineering professionals watching chip and packaging technologies, @wassickt said that AMD has made some upgrades to the Ryzen 7000 series processors and has already prepared for 3D V-Cache technology. The CCD used by the Ryzen 7000 series has a larger and denser array with a smaller pitch and provides more TSV channels, which means that the increased cache chip will have a larger contact area with the CCD. This results in a larger L3 cache bandwidth and possibly additional input power.
It has been reported before that the Zen 4 architecture processor uses the second-generation 3D V-Cache technology, which will have higher bandwidth. Latency will also be improved, and will likely be fabricated on a 6nm process, again bringing an additional 64MB of cache to each Zen 4-architecture CCD. It is rumored that AMD’s first Raphael-X processors will have three models aimed at the high-end market, namely Ryzen 9 7950X3D, Ryzen 9 7900X3D, and Ryzen 7 7800X3D. Then AMD will launch more Ryzen 7000X3D series processors to spread to the mainstream market.
AMD is more committed to popularizing 3D V-Cache technology in the new generation of processors and has also made more adequate preparations. In contrast, the consumer-level Zen 3 architecture chip has only an 8-core 16-thread Ryzen 7 5800X3D, and the rumored Ryzen 9 5900X3D and Ryzen 9 5950X3D did not appear.
Saeid Moshkelani, senior vice president and general manager of AMD’s client business unit, has said that 3D V-Cache technology will be brought to the Ryzen 7000 series by the end of 2022. This means that the Ryzen 7000X3D series is likely to debut at CES 2023.
