iPhone 17’s A19 Pro: Advanced, But Not 2nm
Last year, Apple released several 3nm chips, catalyzing a ramp-up in TSMC’s 3nm production capabilities, with significant gains swiftly reflected in TSMC’s quarterly earnings report. To further enhance computing and graphics performance, Apple has commenced the development of its next-generation chips. It has been reported that Apple will be among the first clients for TSMC’s 2nm process technology, which will produce 2nm chips for iPhones, Macs, iPads, and other devices, with mass production expected in the second half of 2025. Many speculate that the iPhone 17 series will be the first to feature these 2nm chips.
According to Wccftech, the latest reports indicate that the A19 Pro chip, expected to power the iPhone 17 series slated for release in 2025, will not utilize the 2nm process node but will instead employ the N3P process, while this year’s A18 Pro will use the N3E process. Although Apple is a frontrunner in the 2nm domain, this advancement will not materialize until 2026. Besides Apple, Intel has also expressed interest, and it is anticipated that AMD, Nvidia, and MediaTek will follow suit.
Currently, TSMC’s 2nm wafer fabrication facility in Baoshan, Hsinchu, Taiwan, is progressing steadily as planned, and the Kaohsiung facility is poised to commence. TSMC plans to construct a “mini production line” in Baoshan by the end of this year, aiming for mass production in Q4 2025, with an initial monthly capacity of 30,000 to 35,000 wafers. The Kaohsiung plant is expected to begin equipment installation before the end of this year, ahead of schedule, with a goal to start mass production in the first half of 2026, planning a similar capacity to Baoshan.
Once the Baoshan and Kaohsiung 2nm wafer fabrication plants reach mass production, they will enter a phase of capacity enhancement, targeting a combined monthly capacity of 110,000 to 120,000 by 2027. Both will support the initial N2 and the second-generation N2P processes (which include backside power delivery technology). The next-generation 1.4nm process node (A14 process) is expected to commence operations in the second half of 2027, potentially in a newly constructed fab in Taichung.
