Infrared photographer shares AMD Ryzen 7 7800X3D perspective

Recent reports highlight the exceptional popularity of the AMD Ryzen 7 7800X3D processor, equipped with 3D Vertical Cache technology. Indeed, it has shattered sales records at Mindfactory, a prominent German e-commerce platform, just within its second month of launch, amassing a sales volume that nearly doubles that of its predecessor, the Ryzen 7 5800X3D.

The renowned infrared photographer, Fritzchens Fritz, has recently provided intriguing insights into the internal structure of the AMD Ryzen 5 7600 and AMD Ryzen 7 7800X3D processors, through the lens of an infrared microscope. Fritz, an accomplished photographer who has showcased the chip designs of processors such as Ryzen 5 5600G and Core i9-13900K, continues to unravel the differences between these two processor units.

In the bottom right corner, we observe the Core Chiplet Die (CCD), which unveils AMD‘s layout of cores and caches on the chip. Blocks located at the edge are Zen 4 architecture cores, while the central position is occupied by the cache. It is noteworthy that the Ryzen 5 7600 only has six cores, however, these are merely shielded.

The most significant structural divergence between the Ryzen 5 7600 and Ryzen 7 7800X3D lies in the L3 cache. The latter’s CCD introduces SRAM, augmenting the L3 cache capacity by an impressive 64MB. The Ryzen 7 7800X3D employs the second-generation 3D V-Cache technology. Although the SRAM chip still utilises the 7nm manufacturing process, the CCD has evolved from the 7nm process of the Ryzen 7 5800X3D to a more refined 5nm process. While the coverage area exhibits some asymmetry, AMD has introduced modifications to ensure no compromise on performance. This technical nuance is detailed further in prior introductions.

The inclusion of the second-generation 3D V-Cache technology has positioned the Ryzen 7000X3D series processors as some of the most formidable gaming processors available in the current era.