AMD Zen 4 X3D is rumored to be unveiled at CES 2023
AMD released a new generation of Ryzen 7000 series desktop processors based on the Zen 4 architecture yesterday, manufactured with a 5nm process, and the new AM5 platform supports PCIe 5.0 and DDR5 memory. At the event, AMD shared a new CPU architecture roadmap, showing that there will be Zen 4 architecture chips with 3D vertical cache (3D V-Cache) technology.
According to Wccftech, AMD’s first Raphael-X processors will have three models aimed at the high-end market, namely the Ryzen 9 7950X3D, Ryzen 9 7900X3D, and Ryzen 7 7800X3D. Then AMD will launch more Ryzen 7000X3D series processors to spread to the mainstream market.
Saeid Moshkelani, senior vice president and general manager of the client business unit at AMD, said that 3D V-Cache technology will be brought to the Ryzen 7000 series in late 2022, which means the Ryzen 7000X3D series will likely debut at CES 2023.
Obviously, AMD is more committed to popularizing 3D V-Cache technology in the new generation of processors and has also made more adequate preparations, and the interval is shorter. In contrast, the consumer-level Zen 3 architecture chip has only an 8-core 16-thread Ryzen 7 5800X3D, and the rumored Ryzen 9 5900X3D and Ryzen 9 5950X3D did not appear.
It is speculated that Raphael-X will still bring an additional 64MB of cache on each Zen 4 architecture CCD, which is a 10% to 15% improvement over normal Zen 4 architecture processors. It is rumored that the Ryzen 7000X3D series uses the second-generation 3D V-Cache technology, which will have higher bandwidth and lower latency, as well as better support in overclocking. Due to the high cost of TSMC’s 5nm process at this stage, it is likely to use the 6nm process for manufacturing.
