AMD Ryzen 7000: 15% single-thread performance improvement, IOD is 6nm, X670 dual-chip
At Computex 2022, AMD brings the Ryzen 7000 series desktop CPUs. The new generation of Zen 4 architecture products code-named Raphael will use a new AM5 socket (LGA 1718), integrate an RDNA 2 architecture GPU, support PCIe 5.0 and dual-channel DDR5 memory, and the highest TDP is 170W. Compared with the specifications of the AM4 platform, the AM5 platform will bring a comprehensive improvement, but the two remain compatible on the CPU cooler.
According to VideoCardz, the CCD of the Ryzen 7000 series is manufactured using TSMC’s 5nm process, and the IOD has also been upgraded to a 6nm process. AMD claims that the Ryzen 7000 series will have a 15% increase in single-threaded performance (there is no comparison object), the L2 cache capacity per core is 1MB, and the boost clock is greater than 5GHz. In addition, AMD also showed the chip distribution under the top cover of the CPU. There will be two CCDs and one IOD. On the surface, there is not enough space for a third CCD.
It was previously reported that the IPC of Zen 4 is 24% higher than Zen 3, the clock is expected to increase by 8% to 14%, and each core has 1MB L2 and 4MB L3. Zen 3 architecture is 512KB L2 / 4MB L3.
The Ryzen 7000 series is paired with the 600 series chipset, and the first batch of three will be the X670E, X670, and B650. AMD says the X670E (Extreme) is designed for extreme overclocking and unmatched performance. The X670 is aimed at overclocking enthusiasts, with support for PCIe 5.0 storage and optional support for PCIe 5.0 graphics. The B650 is aimed at mainstream platforms and only supports PCIe 5.0 storage, which means that there will be no PCIe 5.0 slots for graphics cards.
Recently, some netizens have leaked a PCB design drawing of the X670 motherboard, and the two chipsets can be clearly seen. Earlier reports pointed out that AMD chose to cooperate with ASMedia, a subsidiary of ASUS, on the new generation of chipsets, using TSMC’s 6nm process to manufacture. It is rumored that AMD has adopted the idea of small chips, the X670 is a dual-chip, and the B650 is a single-chip.
The 600 series motherboards offer up to 24 PCIe 5 lanes, up to 14 SuperSpeed USB 20Gbps (Type-C), WiFI-6E, and DBS/Bluetooth Low Energy 5.2. Rumored 600 series motherboards can be configured with up to four HDMI 2.1 and DisplayPort 2 outputs, the Ryzen 7000 series integrated RDNA 2 architecture GPU will come in handy at this time.
AMD also confirmed that the AM5 platform will support a new technology called Smart Access Storage (SAS). According to previous reports, it is likely to add AMD platform technology on the basis of Microsoft DirectStorage. In addition, AMD will release new technologies involving DDR5 memory overclocking on the AM5 platform, and preset overclocking profiles that will be added to high-end memory modules to replace A-XMP in the era of DDR4 memory.
