AMD Instinct MI300 may use 3D chip stacking 8 compute dies
AMD launched the Instinct MI200 series of computing cards based on the CDNA 2 architecture last year, which is the first GPU to be packaged in an MCM multi-chip package and the first exascale GPU accelerator. In fact, before the release of the Instinct MI200 series, the news of the Instinct MI300 series has already been reported, and it has recently appeared in the Linux patch.
According to VideoCardz, the AMD Instinct MI300 GPU may come in a variety of specifications, with HBM3 memory stacks ranging from two to eight, respectively. It’s worth noting that the Instinct MI300 series GPUs may use 3D chip stacking, with a base tile with I/O interfaces below the small chip. Each base tile is said to connect two HBM3 memory stacks and is fabricated on a 6nm process, while the compute dies are fabricated on a 5nm process.