3D print model LGA 1700 bracket to solve CPU bending problem

The socket of Intel’s 12th-generation Core desktop processor has changed from LGA 1200 to LGA 1700, its shape has also changed from square to rectangle, and the way of locking is different from before. In fact, the latch of the LGA 1700 socket is obviously much more stressed than the LGA 1200 socket, and the more serious problem is that it will bend the processor and affect the heat dissipation effect. Perhaps Intel launched Alder Lake too hastily, resulting in the related optimization work not being done well.

Previously, Igor’sLAB put an M4 washer on each of the four corner screws of the LGA 1700 socket to reduce the locking pressure and effectively reduce the temperature of the processor. Overclocking expert Luumi recently made a video with overclocker Karta to 3D print a plastic bracket for an LGA 1700. The new scheme is more practical and functional.

Luumi was tested with a Core i5-12600K processor and an EVGA Z690 Dark Kingpin motherboard. Prime95 is also used to load, and the results between the original mechanism and the new scheme are compared. It seems that the improvement effect is average, not as good as the scheme of adding 1.0mm spacers to Igor’sLAB. However, Luumi pointed out that this may be a problem with the equipment used for the test or the height of the 3D stand. In fact, the pressure distribution of this 3D print model is indeed better.

Since Igor’sLAB has a successful solution as a reference, the idea has been proved to be effective, Luumi will customize a new 3D bracket. It may be necessary to adjust its height, hoping to achieve the same cooling effect as the spacer solution, so that the Core i5-12600K processor can achieve the best performance.