China’s CXMT plans to enter the DDR5 market this year
CXMT is a China manufacturer specializing in 3D NAND flash memory chips. Its Xtacking 2.0 architecture has been used to manufacture 128-layer stacked 512Gb 3D TLC NAND flash chips, as well as 128-layer stacked 3D QLC NAND flash chips. After dismantling last year, some institutions believed that CXMT’s 128-layer stacking process was sufficient to compete with other products in terms of capacity, bit density, and I/O speed, and had caught up with other leaders in technology. The main direction of CXMT is DRAM chips. At present, it is the largest and only manufacturer capable of manufacturing DDR4/LPDDR4 memory chips in China. Previously, FORESEE and ADATA has all adopted their DDR4 memory chips successively.
(Image credit: Foresee, CXMT)
According to TomsHardware, China’s CXMT is working hard on DDR5 memory and has successfully trial-produced DDR5 memory chips, aiming to achieve mass production by the end of the year. CXMT hopes to launch DDR5/LPDDR5 memory chips manufactured by 17nm or even more advanced processes when it is actually mass-produced.
Recently, CXMT has received new investment, so that it has more funds for R&D and expansion of production capacity. CXMT plans to double its wafer production capacity to 120,000 wafers per month in 2022, with a mid- and long-term target of 300,000 wafers. Although CXMT ‘s wafer production capacity seems to have increased a lot, it is still a long way from its peers. For example, Micron’s wafer production capacity is 2,000,000 wafers per month.
