Samsung will produce 768GB DDR5 memory to meet server and high-performance computing needs

Samsung said in the earnings call that the company is currently in good overall operating conditions and that its memory business unit continues to grow and contributes a lot of profits to the company.

Especially in the high-end server and high-performance computing markets, the steady growth in sales of memory products launched by Samsung also highlights the extremely high potential of this market in the future.

This is also the reason why Samsung continues to develop and promote high-density memory modules in this type of business, such as the 512GB DDR5 memory module recently launched by Samsung.

No matter from which point of view, this is a real high-capacity solution, especially servers and data centers that can meet demand through these high-capacity memories.

In the earnings call, Samsung also revealed that the company plans to continue to increase the ultra-high-density capacity of memory through the production of 24Gb DRAM chips in the near future.

Using this type of chip allows Samsung to build a 768GB DDR5 memory module. It is expected that Samsung will provide sample tests for the Intel platform in the fall.

These memory modules will be manufactured using 14nm nodes, which can meet the capacity and performance requirements of cloud computing platforms, stimulate the trend of high-density memory modules, and so on.

Specifically, Samsung may launch new products at Intel’s innovation event on October 27, and then hand over the adapted hardware to companies in need for testing.

In addition, the 768GB DDR5 module may also use the Samsung S2FPD02 power management integrated circuit, which is expected to achieve 91% power efficiency compared with previous generation products.

Via: Neowin