TSMC will stop supplying chips to Huawei after September 14
On May 15th, the US Department of Commerce upgraded its export control regulations, requiring foreign companies that are not allowed to provide chips to Huawei and HiSilicon affiliates without obtaining a license. This regulation also affects chip manufacturers such as TSMC.
In order to avoid an impact on semiconductor companies and wafers manufacturers, the US Department of Commerce has set aside a 120-day buffer period, which will officially end on September 15.
After the end of the buffer period, wafer manufacturers such as TSMC and other companies that use US corporate technology will no longer be able to supply chips to Huawei and HiSilicon according to the regulations of the US Department of Commerce.
The wafer and chip manufacturing equipment used by the Taiwan Semiconductor Manufacturing Company (TSMC) also uses equipment, parts, and technology provided by American semiconductor companies.
Therefore, according to the regulations of the US Department of Commerce, if TSMC wants to continue to supply chips to Huawei or HiSilicon and other affiliated companies after the end of the buffer period, it also needs to apply for a license.
If TSMC continues to supply without a license, it will violate the regulations of the U.S. Department of Commerce, and U.S. companies may no longer provide technical authorization to TSMC.
The chairman of TSMC said that it is too early to confirm the situation, but based on the current situation, TSMC is not prepared to continue to supply Huawei after September 14.
However, Taiwan media also reported that TSMC has submitted an opinion letter to the US Department of Commerce, striving to continue to supply chips Huawei and HiSilicon after the end of the buffer period.