Tokyo Electron (TEL) has announced the advent of an innovative through-hole etching technique developed and fabricated at its plasma etching system site, intended for the stacking of over 400 layers of advanced 3D NAND...
The 2023 VLSI Technology and Circuits Symposium will take place in Kyoto, Japan, from June 11th to 16th, 2023, where Kioxia and Western Digital will showcase their latest innovations to support future high-capacity, high-performance...
Recently, at the ISSCC 2023 conference, SK Hynix unveiled its latest breakthrough in 3D NAND flash memory development. SK Hynix noted that a team of 35 engineers contributed to the materials presented, introducing a...
