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Tag: MediaTek Dimensity 9300

  • MediaTek launches Dimensity 9300

    MediaTek has announced the launch of the Dimensity 9300, forging a new flagship 5G generative AI chipset tailored for the mobile market. Touted for its revolutionary all-big-core architectural design, the Dimensity 9300 promises unparalleled intelligence, high performance, energy efficiency, and low power consumption, heralding a groundbreaking advancement in technology. This chipset redefines the flagship experience in areas such as on-device generative AI, gaming, and imaging.

    Crafted using TSMC’s third-generation 4nm process, the Dimensity 9300 integrates 22.7 billion transistors and debuts an innovative all-big-core CPU architecture to meet the ever-increasing demands of modern and future mobile computing. Its CPU comprises an octa-core setup with four ultra-large cores (Cortex-X4@3.25 GHz) and four big cores (Cortex-A720@2.0 GHz), delivering a 40% performance boost and 33% power saving over the previous generation. The GPU features a 12-core Immortalis-G720 with a second-generation hardware ray tracing engine, achieving a 46% performance increase and a 40% reduction in power for the same performance level. The integrated seventh-generation AI processor APU 790 houses a hardware-level generative AI engine, doubling the integer and floating-point performance while reducing power consumption by 45%. The chipset includes a flagship-grade ISP, Imagiq 990, supporting full-pixel focus and 2x lossless zoom with an integrated OIS core for image stabilization.

    In other aspects, the Dimensity 9300 supports 9600 MT/s LPDDR5T memory; the display processor MiraVision 990, which can handle 180Hz at WQHD and 120Hz at 4K resolutions, as well as dual-screen display for foldable devices. Additionally, it supports the new Ultra HDR format in Android 14. The 5G modem enables Sub-6GHz four-carrier aggregation (4CC-CA) and dual SIM dual active (DSDA) modes, complemented by the proprietary UltraSave 3.0+ power-saving technology. The chipset also supports Wi-Fi 7 with peak network transfer rates of up to 6.5Gbps, and MediaTek’s Xtra Range 2.0 technology extends indoor coverage by 4.5 meters. It accommodates up to three Bluetooth antennas and features dual Bluetooth fast connection technology, offering an ultra-low latency Bluetooth audio experience. For audio capture, it supports three-microphone dynamic noise reduction with omni-directional high-dynamic recording capabilities, utilizing advanced noise separation technology to effectively filter out environmental noises such as wind. Security is enhanced with integrated dual security chips and the utilization of advanced memory tagging extension (MTE) technology for a safer application development environment.

    MediaTek anticipates that the first smartphones equipped with the Dimensity 9300 chip will hit the market by the end of 2023.

  • MediaTek Dimensity 9300 will be equipped with two Cortex-X4 cores

    Recently, MediaTek introduced the Dimensity 9200+, further enriching its product line. Although this chip, inheriting from the Dimensity 9200, exhibits enhanced performance, its impact is expected to be minimal in light of Qualcomm’s recent aggressive onslaught.

    Evidently, to reinvigorate its assault on the premium market, MediaTek necessitates a substantial leap in chip performance. According to Notebookcheck, MediaTek is advancing the development of its next-generation flagship 5G mobile platform, with the new Dimensity 9300 slated for launch in October 2023. As previously stated, it will be manufactured using TSMC’s N4P process.

    Understood to be adopting a 2+4+2 tri-cluster design for the CPU of the Dimensity 9300, it will feature two Cortex-X4 super cores, four Cortex-A7xx large cores, and two Cortex-A5xx small cores, though the specific frequencies of these cores are not yet clear. Additionally, the GPU component remains a mystery, potentially employing the Immortalis-G720 to deliver superior performance.

    Should MediaTek resolve to incorporate two Cortex-X4 cores in the Dimensity 9300, it would imply higher heat generation, ultimately necessitating frequency adjustments to maintain appropriate power consumption levels. Concurrently, how to better balance workloads presents an issue, lest it results in mere paper specifications without realizing maximum performance.

    Rumors suggest Qualcomm faces similar challenges, potentially launching two versions on the third-generation Snapdragon 8 platform, one with a 2+4+2 tri-cluster CPU design identical to the Dimensity 9300, and another with a 1+5+2 tri-cluster CPU design, both manufactured using TSMC’s N4P process. Opting for the same manufacturing process signifies that Qualcomm and MediaTek are engaged in a more equitable competitive environment.