Micron Introduces Its First UFS 4.0 Mobile Storage Solution

Micron announced the launch of its inaugural UFS 4.0 mobile storage solution, currently disseminating samples to select smartphone manufacturers and product suppliers. Micron asserts that its cutting-edge mobile flash memory outperforms competitors in several pivotal NAND benchmarks, thereby delivering unparalleled performance to smartphones, including swift booting, application launching, and video downloading.

“Micron’s latest mobile solution tightly weaves together our best-in-class UFS 4.0 technology, proprietary low-power controller, 232-layer NAND and highly configurable firmware architecture to deliver unmatched performance,” said Mark Montierth, corporate vice president and general manager of Micron’s Mobile Business Unit. “Together, these technologies position Micron at the forefront of delivering the performance and low-power innovations our customers need to enable an exceptional end-user experience for flagship smartphones.”

Micron’s UFS 4.0 flash memory introduces three capacities, namely 256GB, 512GB, and 1TB. This is its first mobile solution based on the 232-layer 3D TLC NAND flash memory, and the world’s first UFS 4.0 storage product utilizing a six-plane NAND architecture, delivering a maximum sequential read speed of 4300 MB/s and a maximum sequential write speed of 4000 MB/s.

Micron stated that mass production of the UFS 4.0 storage products will commence in the latter half of 2023, providing high-performance mobile flash memory for the mobile ecosystem, thereby empowering the next wave of 5G and AI innovations and device experiences.