Intel may build a semiconductor supply chain in Germany, Italy, and France

Although Intel has decided not to make any investment in Europe this year and has postponed the announcement of its investment in the construction of a fab, it does not mean that Intel will suspend its global increase in production capacity. There have been media reports recently that Intel may change its original semiconductor plan in Europe and use part of its funds for new investments.

Intel originally planned to build a factory group in Europe in two phases. In the first phase, approximately $20 billion will be invested to build two wafer fabs, and then six wafer fabs will be built in phases. Finally, a huge semiconductor park with eight wafer fabs will be built and become a semiconductor manufacturing base worth $100 billion. Intel CEO Pat Gelsinger had previously conducted a series of inspections and visits to Europe, and it was rumored that near Munich in Bavaria, Germany, was the most likely location.

When contacted by Reuters, Intel said “We are encouraged by the many possibilities to support the EU’s digital agenda and 2030 semiconductor ambitions. While current negotiations are ongoing and confidential, we plan to make an announcement as soon as possible.”

Intel stated that it will support the EU’s digital agenda and the 2030 semiconductor plan. The two sides are currently negotiating and are in a confidential stage, but will announce the relevant plans as soon as possible. Some sources pointed out that Intel intends to invest $4 to 8 billion in Italy to build advanced packaging and testing facilities, but the local government is concerned about job creation and energy issues and is skeptical. If Intel cannot give a satisfactory answer, it may cause trouble for follow-up work.