Intel is developing four generations Optane products
3D XPoint was once thought to be an innovative high-density non-volatile memory technology that could create new applications, but the market has never really realized its potential. While still of great value to Intel and the storage industry, its development and production costs may still be too high for the technology to move forward.
According to Blocks & Files, information recently discovered about Intel’s R&D center in New Mexico developing fourth-generation Optane products shows that Intel was already working on it in April 2020. The program manager responsible for the development of the fourth-generation Optane product is Darren Denardis, who was a workshop organizer at Intel’s 2010 Materials Research Society Spring Meeting and holds various patents.
Intel launched the second-generation Optane products in December 2020, and the public Optane technology roadmap shows that the third- and fourth-generation Optane products based on Optane technology will be launched next.
Some time ago, some media found in Intel’s data center and AI business memo that Alper Ilkbahar, the head of Optane business, left Intel on February 11. In addition, Intel’s Optane business was found to be seriously loss-making. Intel’s technology partner, Micron, announced earlier that it would stop the further development of all products based on 3D XPoint technology. At the same time, the 3D XPoint flash memory chip factory in Lehi, Utah was sold to Texas Instruments for $1.5 billion. The prospect of Intel’s Optane business has dimmed after Micron, which had previously been the only manufacturer of 3D XPoint flash memory chips, gave up.
At present, Blocks & Files has sent a letter to Intel to understand the relevant situation but has not yet received a reply.
