Although the shortage of chip supply has caused some setbacks to the development of the industry, TSMC is still advancing semiconductor process technology and has not slackened due to this. According to DigiTimes, TSMC is expected to mass-produce the N3 process node in the second half of 2022 and plans to launch an enhanced 3nm process called N3E. The mass production time is the second half of 2023.
TSMC’s chief financial officer Mr. Wendell Huang pointed
out on the company’s earnings call on October 14 that the N3 process node still uses the structure of FinFET transistors to provide customers with the best technology maturity, performance, and cost. When TSMC’s 3nm process technology is launched, it will become the industry’s most advanced PPA and transistor technology. The N3 process node will become another TSMC’s mass-produced and long-lasting process node. As an extension of N3, N3E will have better performance and power consumption.
As TSMC’s largest customer, this is good news for Apple. At least there is no need to worry that the new chips will be dragged down by process delays. It was previously reported that Intel occupies the most production capacity of TSMC’s N3 process node, and many cooperations between the two parties in the foundry will be carried out on the 3nm process.
According to Nikkei Asia, last week there was further news about the rumors that TSMC and Sony were cooperating to build a fab in Japan
. This fab will begin construction in 2022 and be put into use in 2024. As previously rumored, it will not use advanced technology and focus more on 22nm and 28nm processes, mainly producing image sensors, image processors, and chips required for electric vehicles.