Tag: PowerVia
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Intel will introduce PowerVia technology achievements at the VLSI Symposium
At the ‘Intel Accelerated: Process and Packaging Technology Online Conference’ in July 2021, Pat Gelsinger, CEO of Intel, unveiled a slew of fundamental technological innovations, stating that groundbreaking technologies like RibbonFET and PowerVia would herald the Age of Ångstrom. RibbonFET, an implementation of the Gate All Around transistor, will serve as Intel’s first novel transistor…