AMD may become TSMC’s third largest customer in 2023
At its recent Financial Analyst Day event, AMD released a technology roadmap for the period between 2022 and 2024. Next, the CPU will fully enter the Zen 4 architecture, while the GPU will be converted to the RDNA 3 architecture, the chip will be updated to the 5nm process, and the application of new technologies such as chiplet design and V-Cache will be expanded.
According to China Times, TSMC has monopolized AMD’s 5nm orders, and AMD will become TSMC’s largest customer of the 5nm process next year. AMD has benefited from TSMC’s 7nm and its extended 6nm process, allowing its Zen 3 architecture and RDNA 2 architecture products to continue to expand market share, and has also become the largest customer of the 7nm process node.
According to AMD’s plan, the Zen 4 architecture CPU, codenamed Genoa/Genoa-X (server), Siena (edge computing), Storm Peak (HEDT), Raphael (desktop), and Dragon Range (notebook) will all be manufactured using the 5nm process. In the GPU, the same is true for the Navi 3x series based on the RDNA 3 architecture and the Instinct MI300 series based on the CDNA 3 architecture. In addition, the chips code-named Phoenix Point and Bergamo will use the extended 4nm process, the Phoenix Point is a product of Zen 4+RDNA 3, and the Bergamo uses the Zen 4c architecture for native cloud computing.
AMD completed the acquisition of FPGA giant Xilinx this year, and at the same time acquired DPU manufacturer Pensando. In the future, it will make every effort to attack the cloud, AI, HPC and edge computing markets, and it is possible to further increase the number of orders. It is understood that AMD’s orders for the 5nm process in the fourth quarter of this year will reach the specification of 20,000 wafers, and it has booked a large number of orders for the 5nm process next year. AMD is expected to become TSMC’s third-largest customer in 2023 and is also expected to be the largest customer on the 5nm process node.
