The Compute Tile of Intel Meteor Lake has been powered on

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Meteor Lake is Intel’s first 7nm process technology (Intel 4) product for the consumer market, which incorporates EUV lithography technology and will use Foveros packaging technology. This is Intel’s 14th-generation Core series processor and is expected to be released in 2023. Intel has made a lot of introduction to Meteor Lake before, and its computing module completed the “Tape in” step in May of this year.

According to TomsHardware, recently Intel CEO Pat Gelsinger said on the earnings call this quarter that the computing module of Meteor Lake has been powered on and has been running for 30 minutes. Since Meteor Lake adopts a modular design, it can be stacked with modules of different process nodes. There may be the first module manufactured by other fabs (TSMC) in the package. Foveros packaging technology can omit all the redesign, testing, tapeout, and other processes, and directly encapsulate various mature solutions with different IPs and different processes, thereby greatly reducing costs and increasing product launch speed. Previously, Intel has decided to outsource individual chip production to a third party from 2023, and Foveros packaging technology will be more conducive to Intel’s better arrangements for the production of its own chips.

It is understood that Meteor Lake will adopt a Tile design, and there will be three modules, namely computing module, SOC-LP module (in charge of I/O), and GPU module, and its TDP will be between 5W and 125W. At the same time, a new performance core called “Redwood Cove” will be adopted to replace the “Golden Cove” used on Alder Lake. In addition, it will greatly improve its graphics technology. The minimum configuration of the GPU die is 96 EUs, and the maximum of 192 EUs can be configured. There is also news that Meteor Lake may integrate a visual processing unit (VPU), and will switch to LGA 1800 sockets.

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